U.S. students pursuing a degree in engineering are urged to apply for the 2017 ASCO Engineering Scholarship by March 31.
ASCO will award two $5,000 scholarships to U.S. engineering students, provide $1,000 grants to their collegeβs engineering departments, and host the students at βThe Amazing Packaging Raceβ at PACK EXPO International in 2017.
Applications are now being accepted and may be submitted by the program deadline of March 31. Details and forms are available at .
“2017 marks the 10th year of the ASCO Engineering Scholarship program and, through it, our role in supporting the education of todayβs engineering students in their journey to become tomorrowβs engineering leaders,β said Erik S. VanLaningham, Vice President, Marketing β Americas, ASCO. “We are proud and honored to have invested more than $100,000 over the past decade in the success of our nationβs future engineers.β
Over the past ten years, ASCO has awarded $90,000 in scholarships to 18 students based on their potential for leadership and for making a significant contribution to the engineering profession. Also, ASCO has provided another $18,000 in grants to the engineering departments of the colleges where the recipients are enrolled.
The ASCO scholarship is merit-based and will be awarded based on the candidateβs potential for leadership and for making a significant contribution to the engineering profession, particularly as it relates to the application of fluid control and fluid power technologies. A panel of ASCO executives and independent judges will select the finalists.
Students seeking to submit a scholarship application must be enrolled full-time in an undergraduate or graduate program in an instrumentation, systems, electrical, mechanical, or automation engineering discipline at an accredited U.S. educational institution for the 2017/2018 academic year. Candidates must also maintain at least a 3.2 cumulative GPA on a 4.0 scale, and be a U.S. citizen or legal U.S. resident. The deadline to apply is March 31. Details and forms are available at .
ASCO will award the scholarships at βThe Amazing Packaging Raceβ at PACK EXPO International, to take place in Las Vegas from September 25 β 27. The race, sponsored by ASCO, is a fun and educational event that pits teams of packaging students, from programs around the country, against each other in a race to gather points by completing tasks at specific PACK EXPO booths.
ASCO, an Emerson company
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It is very nice that your blog is providing information regarding the program that is really helpful for the community and students.
We also want to draw your attention towards Utah Valley University Deanβs Merit Scholarship All junior and senior students can apply.
Application Deadline: February 1, 2017
get more information through the given link:
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